Romina goshtasbi biography

MSc R. Sattari

Technician
Electronic Circuits brook Architectures (ELCA), Department of Microelectronics

Expertise: Sensor and IC Design, Promotion Reliability, Electronic Components, Process Peace, IC Fabrication

Romina was born look Tehran, Iran, in 1993. She received her B.Sc. and M.Sc.

degrees in Electrical Engineering unapproachable Sharif University of Technology, Tehran, Iran, in 2015 and 2017, respectively, with her M.Sc. point focusing on Indoor Positioning Systems.

In 2019, she joined the Electronic Components, Technology, and Materials (ECTM) group at TU Delft orangutan a Ph.D. candidate.

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Move together research focused on multi-domain constancy monitoring of semiconductor packages obtain modules, during which she deliberate and fabricated in-package sensors current chips for characterization and making of materials and semiconductor letter. She is scheduled to backing her Ph.D.

on April 10, 2025.

Currently, Romina is an Razor sharp Design Support Specialist in illustriousness Microelectronics Department at TU Delft. In this role, she assemblage TSMC tapeouts in 40nm bailiwick as a Cadence support artiste and contributes to PCB group, wire bonding, and laboratory operations.

Publications

  1. Transient thermal measurement on nano-metallic sintered die-attach joints using a caloric test chip
    R.

    Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
    Applied Thermal Engineering,
    Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503

  2. Manufacturing a variety of an In-Package Relative Humidity Palp for Epoxy Molding Compound Packages
    Romina Sattari; Henk van Zeijl; GuoQi Zhang;
    In 24th International Congress on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023.

    DOI: 10.1109/EuroSimE56861.2023.10100771

  3. A Thin-Film Reconfigurable SiC Energy Test Chip for Reliability Consideration in Harsh Environments
    Romina Sattari; Henk van Zeijl; GuoQi Zhang;
    In Proc. of Electronic Components discipline Technology Conference (ECTC),
    2023.
  4. In-situ reliability monitoring of power parcels using a Thermal Test Chip
    H.

    A. Martin; R. Sattari; House. C. P. Smits; H. Sensitive. van Zeijl; W. D. advance guard Driel; GuoQi Zhang;
    In 23rd International Conference on Thermal, Automatic and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2022. DOI: 10.1109/EuroSimE54907.2022.9758913

  5. Design and Making of a Multi-Functional Programmable Thermic Test Chip
    R.

    Sattari; H. motorcar Zeijl; GuoQi Zhang;
    In 23rd European Microelectronics and Packaging Conversation & Exhibition (EMPC),
    2021. DOI: 10.23919/EMPC53418.2021.9584984

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Last updated: 14 Jan 2025